Application of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrier
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United States of America Patent
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-
Sep 15, 1998
Grant Date -
N/A
app pub date -
Dec 22, 1995
filing date -
Dec 22, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.
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