Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element
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United States of America Patent
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Jan 9, 2007
Issued Date -
N/A
app pub date -
Mar 15, 2004
filing date -
Mar 17, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device substrate includes a substrate body having a wiring layer. A base is formed by a material that is different from a material of the substrate body. The base supports the substrate body, and has an opening forming portion where a semiconductor element is mounted. A reinforcing member is larger than the opening forming portion, provided in the substrate body at a portion corresponding to the opening forming portion, and reinforces the substrate body at the portion corresponding to the opening forming portion.
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