Thermally enhanced component substrate
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United States of America Patent
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Sep 19, 2006
Grant Date -
Dec 16, 2004
app pub date -
Jun 10, 2003
filing date -
Jun 10, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An IC package dissipates thermal energy using thermally and electrically conductive projections. The IC package includes a substrate material with a die pad area, which is suitable to support an integrated circuit. A plurality of solder ball pads is disposed on a first surface of the substrate material and a plurality of conductive projections radiate outwardly from the die pad area and extend to cover a corresponding selected solder ball pad to facilitate the dissemination of thermal energy from the die pad area to the substrate and/or printed wiring board.
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