Coil electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11664149
APP PUB NO 20200143975A1
SERIAL NO

16550716

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A coil electronic component includes a support substrate having a through-hole. First and second coil patterns are disposed on a first surface and a second surface of the support substrate opposing each other, respectively, and each surround the through-hole and are coiled. An encapsulant encapsulates at least portions of the support substrate and the first and second coil patterns, and external electrodes are disposed externally of the encapsulant and are each connected to a respective lead-out pattern connected to a respective one of the first and second coil patterns. A groove penetrates the first surface of the support substrate in a region of the first surface in which the first coil pattern is not disposed, and the second coil pattern is disposed in a region of the second surface of the support substrate that overlaps along a thickness direction with the groove penetrating the first surface.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDSUWON-SI GYEONGGI-DO 443-743

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Jong Min Suwon-si, KR 236 1248
Park, Kwang Il Suwon-si, KR 64 623

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