Semiconductor MEMS structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10273142
APP PUB NO 20180099865A1
SERIAL NO

15819346

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. The structure also includes a movable membrane in the cavity. Further, the structure includes a mesa in the cavity and the mesa is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the mesa, wherein the dielectric layer includes a first surface in contact with the mesa and a second surface opposite to the first surface is positioned toward the cavity.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsieh, Yuan-Chih Hsinchu, TW 100 990
Lin, Hsing-Lien Hsin-Chu, TW 110 932
Peng, Jung-Huei Hsinchu Hsien, TW 101 1105
Wu, Yi-Chien Taichung, TW 14 43

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