Manufacturing method of array substrate

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United States of America Patent

PATENT NO 11798959
APP PUB NO 20230163145A1
SERIAL NO

16965495

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Abstract

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Provided are an array substrate and a manufacturing method thereof, the manufacturing method includes: forming a first active layer on a base substrate; forming a second active layer; forming a second gate on the second active layer; forming a first insulating layer covering the first active layer on the second gate; patterning the first insulating layer to form first via holes at both sides of the second gate to expose the second active layer; depositing a first metal layer in the first via holes and on the first insulating layer; patterning the first metal layer, removing a part of the first metal layer above the first active layer to expose the first insulating layer; etching the first insulating layer using the patterned first metal layer as a mask, forming second via holes above the first active layer to expose the first active layer; cleaning the exposed first active layer.

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Patent Owner(s)

Patent OwnerAddress
BOE TECHNOLOGY GROUP CO LTD100015 NO 10 JIUXIANQIAO ROAD BEIJING CHAOYANG DISTRICT BEIJING CITY BEIJING CITY 100015

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Xinhong Beijing, CN 33 28
Ning, Ce Beijing, CN 76 103
Wang, Lizhong Beijing, CN 71 93
Yang, Wei Beijing, CN 1055 3401
Yuan, Guangcai Beijing, CN 202 331
Zhou, Tianmin Beijing, CN 23 22

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