Microwave applicator and method of forming a microwave applicator

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United States of America Patent

PATENT NO 11701173
APP PUB NO 20190298447A1
SERIAL NO

16447663

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Abstract

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A method of forming a microwave applicator comprising forming a body comprising dielectric material so that there is a void in the dielectric material, and depositing conductive material in the void to form a feed for coupling energy into the dielectric material.

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Patent Owner(s)

  • EMBLATION LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beale, Gary Alloa, GB 32 79
McErlean, Eamon Alloa, GB 31 59

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