Apparatus and method for removing material from microfeature workpieces
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United States of America Patent
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Oct 21, 2008
Grant Date -
Mar 1, 2007
app pub date -
Aug 31, 2005
filing date -
Aug 31, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative of frictional force at an interface between the workpiece and the surface of the fixed-abrasive medium. This method continues by moving at least one of the workpiece and the fixed-abrasive medium relative to each other in a direction transverse to the interface based on the parameter. For example, the workpiece and/or the fixed-abrasive medium can be vibrated or oscillated to reduce the frictional force and/or maintain a desired relative velocity between the workpiece and the fixed-abrasive medium.
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