Terminal electrode forming method in chip-style electronic component and apparatus therefor
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United States of America Patent
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Jun 15, 2004
Grant Date -
Feb 7, 2002
app pub date -
Mar 30, 2001
filing date -
Mar 31, 2000
priority date (Note) -
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Abstract
The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.
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