Method of enabling selective area plating on a substrate
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United States of America Patent
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Feb 22, 2011
Grant Date -
May 27, 2010
app pub date -
Nov 25, 2008
filing date -
Nov 25, 2008
priority date (Note) -
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Abstract
A method of enabling selective area plating on a substrate (201) includes forming a first electrically conductive layer (310) on the substrate, covering the electrically conductive layer with an anti-electroless plating layer (410), patterning the substrate in order to form therein a feature (510, 520) extending through the anti-electroless plating layer and the first electrically conductive layer, forming a second electrically conductive layer (610) adjoining and electrically connected to the first electrically conductive layer, forming a third electrically conductive layer (710) over the second electrically conductive layer, and removing the anti-electroless plating layer and the first electrically conductive layer.
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