Semiconductor package and method of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11854929
APP PUB NO 20230061968A1
SERIAL NO

17460356

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Importance

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Abstract

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An semiconductor package includes a redistribution structure, a first semiconductor device, a second semiconductor device, an underfill layer and an encapsulant. The first semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the first semiconductor device has a first bottom surface, a first top surface and a first side surface connecting with the first bottom surface and the first top surface, the first side surface comprises a first sub-surface and a second sub-surface connected with each other, the first sub-surface is connected with the first bottom surface, and a first obtuse angle is between the first sub-surface and the second sub-surface. The second semiconductor device is disposed on and electrically connected with the redistribution structure, wherein the second semiconductor device has a second bottom surface, a second top surface and a second side surface connecting with the second bottom surface and the second top surface, the second side surface faces toward to the first side surface, the second side surface comprises a third sub-surface and a fourth sub-surface connected with each other, the third sub-surface is connected with the second bottom surface, and a second obtuse angle is between the third sub-surface and the fourth sub-surface. The underfill layer is between the first semiconductor device and the second semiconductor device, between the first semiconductor device and the redistribution structure, and between the second semiconductor device and the redistribution structure. The encapsulant encapsulates the first semiconductor device, the second semiconductor device and the underfill layer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chien-Hung Hsinchu, TW 378 1458
Jeng, Shin-Puu Hsinchu, TW 754 15808
Lin, Po-Yao Hsinchu County, TW 215 987
Lin, Yu-Sheng Hsinchu County, TW 153 513
Wang, Chin-Hua New Taipei, TW 92 56
Yeh, Shu-Shen Taoyuan, TW 130 78

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