Fluxless die-to-heat spreader bonding using thermal interface material
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United States of America Patent
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Mar 7, 2006
Issued Date -
N/A
app pub date -
Mar 9, 2004
filing date -
May 12, 2003
priority date (Note) -
Expired
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Abstract
A thinned semiconductor die is coupled to an integrated heat spreader with thermal interface material to form a semiconductor package. The method for forming the package comprises forming a metallization layer on a backside of a thinned semiconductor die. A thermal interface portion, including a solder layer including a fluxlessly-capable solder such as AuSn, is formed on a topside of the integrated heat spreader. The metallization layer and the solder layer are then forced together under load and heat without flux to bond the semiconductor die to the integrated heat spreader.
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