Wiring board and its production process
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United States of America Patent
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Jun 6, 2006
Issued Date -
N/A
app pub date -
Dec 19, 2003
filing date -
Dec 24, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate, wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except for top portions of the yarns.
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Cited Art Landscape
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