Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

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United States of America Patent

PATENT NO 8330273
APP PUB NO 20110024915A1
SERIAL NO

12904628

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Abstract

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A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A first material is deposited in the through hole.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brunnbauer, Markus Lappersdorf, DE 65 1611
Pohl, Jens Bernhardswald, DE 135 1803
Steiner, Rainer Regensburg, DE 20 213

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