Manufacture method for a surface mounted power LED support and its product
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United States of America Patent
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Oct 13, 2015
Grant Date -
May 16, 2013
app pub date -
Aug 25, 2010
filing date -
Jun 4, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacture method for a surface mounted power LED support comprises providing a wiring board having both sided metal layers. In addition, the method comprises forming a hole. Further, the method comprises setting a metal layer in the surface of the hole. Still further, the method comprises thickening the metal layer of the wiring board. The method also comprises etching the metal layer of the wiring board. Moreover, the method comprises cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board, a hole formed in the wiring board and wiring layers set on the surface of the wiring board.
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