Sensor, method, and design structure for a low-k delamination sensor
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United States of America Patent
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May 18, 2010
Grant Date -
Oct 1, 2009
app pub date -
Mar 27, 2008
filing date -
Mar 27, 2008
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Abstract
The invention generally relates to a design structure of a circuit design, and more particularly to a design structure of a delamination sensor for use with low-k materials. A delamination sensor includes at least one first sensor formed in a layered semiconductor structure and a second sensor formed in the layered semiconductor structure. The at least one first sensor is structured and arranged to detect a defect, and the second sensor is structured and arranged to identify an interface where the defect exists.
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