Method and system for overlay control
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United States of America Patent
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Dec 24, 2019
Grant Date -
Nov 15, 2018
app pub date -
Jul 23, 2018
filing date -
Sep 4, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for overlay monitoring and control is introduced in the present disclosure. The method includes selecting a group of patterned wafers from a lot using a wafer selection model; selecting a group of fields for each of the selected group of patterned wafers using a field selection model; selecting at least one point in each of the selected group of fields using a point selection model; measuring overlay errors of the selected at least one point on a selected wafer; forming an overlay correction map using the measured overlay errors on the selected wafer; and generating a combined overlay correction map using the overlay correction map of each selected wafer in the lot.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- G21K:TECHNIQUES FOR HANDLING PARTICLES OR ELECTROMAGNET....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- G06F:ELECTRIC DIGITAL DATA PROCESSING
- G01P:MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, D....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
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