Semiconductor device
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United States of America Patent
Stats
-
Apr 1, 1980
Grant Date -
N/A
app pub date -
May 31, 1978
filing date -
Jun 3, 1977
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device comprises a semiconductor substrate and at least one supporting electrode soldered to one surface of the semiconductor substrate. The supporting electrode is constituted by a composite body having fibers embedded in a matrix of an electrically conductive metal. The coefficient of the thermal expansion of the fibers is substantially equal to or smaller than that of the semiconductor substrate. The fiber is arrayed in an annular, circular, spiral or the like pattern at least in the surface portion of the composite body on which the composite body is bonded to the substrate.
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