Multilayer wiring board
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United States of America Patent
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Jun 14, 2016
Grant Date -
Jul 30, 2015
app pub date -
Sep 19, 2014
filing date -
Jan 24, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayer wiring board including a multilayer body including a plurality of insulating layers includes a ground electrode for external connection disposed in a center of a lower surface of the multilayer body, a plurality of individual electrodes at an outer edge of the lower surface of the multilayer body, and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the individual electrodes, the surface covering portion being disposed on a surface of a main body of the ground electrode to divide the surface of the main body into a plurality of regions.
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