Semiconductor module with two cooling surfaces and method
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United States of America Patent
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Apr 5, 2011
Grant Date -
Feb 18, 2010
app pub date -
Aug 15, 2008
filing date -
Aug 15, 2008
priority date (Note) -
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Abstract
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.
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