Uniform recess depth of recessed resist layers in trench structure
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United States of America Patent
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Nov 19, 2002
Grant Date -
N/A
app pub date -
Jan 11, 2000
filing date -
Jan 11, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for forming uniform-depth recesses across areas of different trench density, in accordance with the present invention, includes providing a substrate having trenches formed therein. The substrate includes regions of different trench density. The trenches are filled with a first filler material, and the first filler material is removed from a surface of the substrate. A second filler material is formed over the surface of the substrate such that the depth of the second filler material is substantially uniform across the regions of different trench density. Recesses are formed in the trenches such that the recess depth below the surface of the substrate is substantially uniform across the regions
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