Process for producing structures in resist layers using ultrasonic irradiation

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United States of America Patent

PATENT NO 4612267
SERIAL NO

06733188

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Abstract

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A process for the production of structures by the polymerization, or fragmentation of resist layers comprising the steps of effecting an incomplete exposure of the resist layer corresponding to the pattern of the structures, and of fully developing the structure in the resist layer by ultrasonic irradiation. An acoustic microscope is preferably used for the ultrasonic irradiation, whereby the formation of the structure in the resist layer may also be observed.

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Patent Owner(s)

  • ERNST LEITZ WETZLAR GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heitmann, Knut Wetzlar, DE 8 62
Hoppe, Martin Wetzlar, DE 8 61
Schneider, Eckhard Wetzlar, DE 19 187
Thaer, Andreas Leihgestern, DE 4 40

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