Optical semiconductor housing with transparent chip and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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May 8, 2007
Grant Date -
Apr 21, 2005
app pub date -
Dec 21, 2001
filing date -
Dec 29, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
Optical semiconductor package and its method of fabrication, which package comprises a semiconductor component (6), a rear face of which is attached to a front face of a mounting and electrical connection support (2) and a front face of which comprises an optical sensor (9), means (11) for electrically connecting the semiconductor component to the support, a transparent chip (12) placed in front of the semiconductor component, which lies at least in front of the optical sensor, and encapsulation means (21) comprising an encapsulation material which envelopes, in front of the support, the periphery of the semiconductor component and of the chip, without covering at least the central part of the front face of this chip.
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