Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader
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United States of America Patent
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Jan 1, 2008
Grant Date -
N/A
app pub date -
Jul 8, 2004
filing date -
Jul 19, 2002
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Abstract
A ball grid array package is manufactured by mounting a semiconductor die to a first surface of a substrate and mounting a die adapter to the semiconductor die. The semiconductor die is wire bonded to ones of conductive traces of the substrate. A collapsible spacer is mounted to the substrate and the substrate is releasably clamped to an upper side of a mold cavity. A heat spreader and at least one collapsible spacer are placed in the mold cavity such that the collapsible spacer is disposed between the heat spreader and the substrate. A molding compound is molded in the mold, thereby molding the semiconductor die, the substrate, the wire bonds, the die adapter, the at least one collapsible spacer and the heat spreader into the molding compound to provide a molded package. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- UTAC HEADQUARTERS PTE. LTD.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Fan, Chun Ho | Sham Tseng, HK | 59 | 3443 |
Kirloskar, Mohan | Cupertino, CA | 20 | 1062 |
Labeeb, Sadak Thamby | Tsuen Wan, HK | 6 | 398 |
Lam, Wing Keung | Kowloon, HK | 9 | 316 |
McLellan, Neil | Danville, CA | 85 | 4549 |
Sze, Ming Wang | Tsuen Wan, HK | 13 | 529 |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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