Material management apparatus and material preparing method
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United States of America Patent
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Oct 26, 2021
Grant Date -
Nov 15, 2018
app pub date -
Apr 13, 2018
filing date -
May 10, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A material management apparatus (management computer) includes a production plan acquirer that acquires production plan information including a type of a material (cream solder) for bonding a component to a substrate, the material being used for production of a mounting substrate obtained by mounting the component on the substrate; a material status acquirer that acquires material status information on the material preserved in a material preservatory which preserves an accommodating portion (solder pot) in which the material is accommodated; and a material preparation instructor that creates and transmits an instruction to prepare the accommodating portion to be put out from the material preservatory, based on the production plan information and the material status information.
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