Data center
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United States of America Patent
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Jun 19, 2012
Grant Date -
Mar 15, 2012
app pub date -
Oct 31, 2010
filing date -
Sep 14, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles.
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