Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules

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United States of America Patent

PATENT NO 11721583
APP PUB NO 20220044968A1
SERIAL NO

16989746

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Abstract

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In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

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Patent Owner(s)

  • APPLIED MATERIALS INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Balakrishnan, Karthik Singapore, SG 335 2021
Elumalai, Karthik Singapore, SG 13 48
Peh, Eng Sheng Singapore, SG 24 56
Thirunavukarasu, Sriskantharajah Singapore, SG 47 130

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