Solder paste and printed circuit board
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United States of America Patent
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Mar 23, 2010
Grant Date -
Nov 23, 2006
app pub date -
Mar 31, 2004
filing date -
Apr 1, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the composition of the powder mixture is 5-10 mass % of Zn; 0.005-1.5 mass % of Ag; optionally at least one of 0.002-1.0 mass % of Cu, 0.005-15 mass % of Bi, 0.005-15 mass % of In, and 0.005-1.0 mass % of Sb; and a remainder of Sn.
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