Single-packaged epoxy resin coating composition
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United States of America Patent
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-
Sep 3, 2002
Grant Date -
N/A
app pub date -
May 26, 2000
filing date -
May 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a single-packaged epoxy resin coating composition comprising: (A) an epoxy resin having at least one epoxy group in a molecule and capable of being dissolved in the following organic solvent (D), (B) a ketimines compound having at least two primary amino groups blocked with a carbonyl compound and having no other amino groups than the above blocked amino groups, (C) a dehydrating agent and (D) an organic solvent, wherein the above organic solvent (D) comprises a hydrocarbon base solvent selected from the group consisting of an aliphatic hydrocarbon base solvent and an aromatic hydrocarbon base solvent having a boiling point of 148.degree. C. or higher in a proportion of at least 95% by weight based on the above organic solvent (D).
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