Substrate
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United States of America Patent
Stats
-
Oct 31, 1995
Issued Date -
N/A
app pub date -
May 20, 1993
filing date -
Aug 18, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate for electronic components has a layer of material covering at least a portion of the substrate. Recesses are formed in a layer of material and located in a pattern relative to each other to form a predetermined temperature distribution across the layer of material. The layer of material can be formed as a resistive film for a heating resistor element. The shape, size and pattern of the recesses are selected to balance the thermal stress across the surface of the layer of material.
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