Surface mount adhesive, mounting structure including the same, and method for producing mounting structure

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United States of America Patent

PATENT NO 8481629
APP PUB NO 20090277678A1
SERIAL NO

12431303

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Abstract

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A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.

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Patent Owner(s)

  • PANASONIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuwabara, Ryo Osaka, JP 8 29
Miyakawa, Hidenori Osaka, JP 32 201
Yamaguchi, Atsushi Osaka, JP 346 2210

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