Advanced copper interconnects with hybrid microstructure

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11222817
APP PUB NO 20200227317A1
SERIAL NO

16835056

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Abstract

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A device relates to a semiconductor device. The semiconductor device includes a narrow-line bamboo microstructure integrated within a metal layer of the semiconductor device and a narrow-line polycrystalline microstructure. The narrow-line polycrystalline microstructure is integrated within the same metal layer as the narrow-line bamboo microstructure.

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Patent Owner(s)

  • TESSERA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Edelstein, Daniel C White Plains, US 301 6063
Yang, Chih-Chao Glenmont, US 1037 7593

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