Backlight module
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United States of America Patent
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Aug 19, 2014
Grant Date -
Sep 19, 2013
app pub date -
Mar 23, 2012
filing date -
Mar 13, 2012
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention provides a backlight module, which includes a backplane and a backlight source fixed to the backplane through fusion. The backplane includes a first backplane segment and a second backplane segment coupled to the first backplane segment. The present invention provides a backlight module, which includes a backplane that is formed by combining a material of high thermal conductivity and a material of high strength. The backplane has a great strength, excellent thermal conductivity, and low cost so as to reduce the overall cost of the entire backlight module. Further, a backlight source is fixed, through fusion, to the backplane made of a material of high thermal conductivity so that the backlight source and the backplane are connected in a gap-free manner to further improve the performance of thermal conduction of the backlight module.
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