Inorganic-based embedded-die layers for modular semiconductive devices

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United States of America Patent

PATENT NO 11798887
SERIAL NO

17492476

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A glass substrate houses an embedded multi-die interconnect bridge that is part of a semiconductor device package. Through-glass vias communicate to a surface for mounting on a semiconductor package substrate.

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INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Darmawikarta, Kristof Chandler, US 140 139
Ibrahim, Tarek Mesa, US 17 80
Mallik, Debendra Chandler, US 178 2179
Manepalli, Rahul N Chandler, US 93 379
Pietambaram, Srinivas V Chandler, US 160 621
Sankman, Robert L Phoenix, US 165 1597

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