Organic solderability preservative and method

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United States of America Patent

PATENT NO 8961678
APP PUB NO 20140174322A1
SERIAL NO

13722768

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Abstract

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An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.

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Patent Owner(s)

  • ROHM AND HAAS ELECTRONIC MATERIALS LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bayes, Martin W Hopkinton, MA 26 163
Chan, Chit Yiu Shatin, HK 9 14
Tang, Qin Fanling, HK 5 3
Tong, Kit Ho Howloon, HK 3 1

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