High capacity memory with stacked layers
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United States of America Patent
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May 31, 2011
Grant Date -
Apr 30, 2009
app pub date -
Oct 28, 2008
filing date -
Oct 29, 2007
priority date (Note) -
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Abstract
A element group includes a plurality of semiconductor elements stacked in a step-like shape on a wiring board. The semiconductor elements are electrically connect to connection pads of the wiring board through metal wires. Among the plural semiconductor elements stacked in a step-like shape, the uppermost semiconductor element has a thickness larger than that of the semiconductor element immediately below it.
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