Microelectronic assembly with an embedded waveguide adapter and method for forming the same
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United States of America Patent
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Oct 9, 2012
Grant Date -
Sep 6, 2012
app pub date -
Mar 30, 2012
filing date -
Jan 25, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor.
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