Semiconductor chip and stacked semiconductor package having the same
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United States of America Patent
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Oct 9, 2012
Grant Date -
May 26, 2011
app pub date -
Jul 14, 2010
filing date -
Nov 20, 2009
priority date (Note) -
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Abstract
A semiconductor chip and a stacked semiconductor package are presented. The semiconductor chip includes a semiconductor substrate, circuit patterns, first input/output pads and second input/output pads. The semiconductor substrate is divided into cell and peripheral regions and has first and second surfaces which oppose each other. The circuit patterns are formed on the first surface of the semiconductor substrate and are connected with the cell region and the peripheral region. The first input/output pads are formed in the cell region and are connected to the circuit patterns. The second input/output pads are formed in the peripheral region and connected with the circuit patterns.
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