Semiconductor device including semiconductor element mounted on another semiconductor element
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United States of America Patent
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Sep 23, 2008
Grant Date -
Aug 4, 2005
app pub date -
Mar 11, 2005
filing date -
Jul 1, 1999
priority date (Note) -
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Abstract
A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without solder balls. At least one first semiconductor element is mounted to the second semiconductor element at the area of the first surface without solder balls. The at least one first semiconductor element may be mounted to the second semiconductor element using solder joints.
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