Fluid ejection head assembly
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United States of America Patent
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-
Mar 13, 2007
Grant Date -
Aug 4, 2005
app pub date -
Jan 30, 2004
filing date -
Jan 30, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.
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