Welded wire cooling
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 22, 1987
Grant Date -
N/A
app pub date -
May 12, 1986
filing date -
May 12, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved thermal management technique is disclosed for use in semiconductor device packaging utilizing ultrasonic welding to attach aluminum wires of predetermined diameter at one end directly to preselected hot spots on the device and at the other end to thermally conductive package elements.
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