Lead frame for resin-molded semiconductor device
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United States of America Patent
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-
Nov 16, 2004
Grant Date -
Jul 31, 2003
app pub date -
Jan 21, 2003
filing date -
Jan 28, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A lead frame for a resin-molded semiconductor device is provided with die pads for separately mounting chips of power elements and a control IC thereon; terminal leads arranged in a row at one side and including leads for the die pads, and a main circuit, a control power supply and signal circuit separated from the die pads; and a dam bar connecting the terminal leads. In the main circuit terminals and control power supply terminals, a plurality of leads is formed and drawn in advance. After the lead frame is set in a mold die and is resin-molded, certain leads that are not used as the terminal leads are selected among the plurality of the leads, and the certain leads are cut and removed together with the dam bar.
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