Device for manufacturing an electrode plate assembly for lead accumulator
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United States of America Patent
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Sep 19, 2000
Grant Date -
N/A
app pub date -
Jul 6, 1998
filing date -
Sep 5, 1997
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Abstract
A number of strap-forming metal molds 12 corresponding to the number of steps are arranged on a circumferential track and are fed to the devices of the respective steps A.about.F together with electrode plate groups 10. Position A is an electrode plate group 10 introduction position; position B is a flux coating position in which electrode plate leads 6 are coated with flux; position C is an auxiliary heating position in which a mold 8 is heated to the temperature of the molten lead; position D is a molten lead pouring position in which molten lead is poured into a mold 8; position E is a strap-forming position in which electrode plate leads 6 are inserted into the molten lead, fused and cooled and the molten lead is solidified; position F is a discharge position in which a completed electrode plate assembly is discharged. Heating of a mold 8 is commenced by inductive heating from position F and is continued to position E.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- GS YUASA INTERNATIONAL LTD.
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Hiramatsu, Akitoshi | Toyokawa, JP | 4 | 7 |
Makino, Kunio | Kosai, JP | 8 | 167 |
Miyagi, Rikio | Kosai, JP | 3 | 15 |
Seta, Fumiaki | Hirakata, JP | 4 | 37 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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