Double-packaged multi-chip semiconductor module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 21, 2007
Grant Date -
Aug 21, 2003
app pub date -
Apr 25, 2003
filing date -
Mar 26, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plurality of semiconductor die is packaged into one component. The inventive design comprises devices which have been singularized, packaged and thoroughly tested for functionality and adherence to required specifications. A plurality of packaged devices is then received by a housing. The conductive leads of the packaged devices are electrically coupled with pads manufactured into the housing. These pads are connected to traces within the housing, which terminate externally to the housing. Input/output leads are then electrically coupled with the traces, or are coupled with the traces as the housing is manufactured. The input/output leads provide means for connecting the housing with the electronic device or system into which it is installed. A lid received by the housing hermetically seals the packaged die in the housing, and prevents moisture or other contaminants which may impede the proper functionality of the die from entering the housing.
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