Electrostatic chuck for an electrically insulative substrate, and a method of using same
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United States of America Patent
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Apr 24, 2007
Grant Date -
Nov 4, 2004
app pub date -
May 28, 2004
filing date -
May 25, 1999
priority date (Note) -
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Abstract
An electrostatic chuck for attracting an insulative substrate to be processed, the electrostatic chuck comprising a dielectric layer having a first surface which attracts an insulative substrate, and a second surface on which are provided a plurality of electrodes, and an insulative support base plate fixing said dielectric layer. A distance between adjacent ones of the electrodes and the thickness of the dielectric layer are adjusted such that when a potential difference is established between the electrodes, a non-uniform electric field is formed in which the insulative substrate is partially polarized and attracted to the first surface by gradient force.
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