Method of making flexible printed circuit board and flexible printed circuit board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11523518
APP PUB NO 20210022254A1
SERIAL NO

16766884

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to an aspect of the present disclosures, a method of making a flexible printed circuit board, which includes a base film having an insulating property, a conductive pattern disposed on either one or both surfaces of the base film, and a cover layer covering a conductive-pattern side of a laminated structure inclusive of the base film and the conductive pattern, includes a superimposing step of superimposing a cover film on the conductive-pattern side of the laminated structure, the cover film having a first resin layer and a second resin layer that is laminated to an inner side of the first resin layer and that softens at a lower temperature than does the first resin layer, and a pressure bonding step of vacuum bagging the laminated structure and the cover film at a temperature higher than a softening temperature of the second resin layer.

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Patent Owner(s)

  • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Noguchi, Kou Shiga, JP 10 4
Ueda, Hiroshi Shiga, JP 536 6290

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