Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
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United States of America Patent
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Sep 29, 2020
Grant Date -
Mar 14, 2019
app pub date -
Mar 10, 2017
filing date -
Mar 10, 2016
priority date (Note) -
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Abstract
Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 μm or more and 200 μm or less.
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