3D semiconductor devices and structures with at least one vertical bus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11488939
APP PUB NO 20220149012A1
SERIAL NO

17581977

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Abstract

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A 3D device comprising: a first level comprising first transistors, said first level comprising a first interconnect; a second level comprising second transistors, said second level overlaying said first level; a third level comprising third transistors, said third level overlaying said second level; a plurality of electronic circuit units (ECUs), wherein each of said plurality of ECUs comprises a first circuit, said first circuit comprising a portion of said first transistors, wherein each of said plurality of ECUs comprises a second circuit, said second circuit comprising a portion of said second transistors, wherein each of said plurality of ECUs comprises a third circuit, said third circuit comprising a portion of said third transistors, wherein each of said ECUs comprises a vertical bus, wherein said vertical bus comprises greater than eight pillars and less than three hundred pillars and provides electrical connections between said first circuit and said second circuit.

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Patent Owner(s)

  • MONOLITHIC 3D INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cronquist, Brian Klamath Falls, US 284 3817
Han, Jin-Woo San Jose, US 144 2734
Or-Bach, Zvi Haifa, IL 534 17875

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