Base layer, polishing pad with base layer, and polishing method
Number of patents in Portfolio can not be more than 2000
United States of America
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Sep 24, 2019
Grant Date -
Nov 23, 2017
app pub date -
May 18, 2017
filing date -
May 18, 2017
priority date (Note) -
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status (Latency Note)
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Abstract
A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.
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