Die seal ring and wafer having the same

United States of America Patent

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Sep 14, 2010
Grant Date
Jan 1, 2009
app pub date
Jun 29, 2007
filing date
Jun 29, 2007

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Abstract

A die seal ring disposed in a die and surrounding an integrated circuit region of the die is described. The die seal ring has at least two different local widths.

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Patent Owner(s)

UNITED MICROELECTRONICS CORP.

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Wu, Ping-Chang	Hsinchu County, TW	31	155

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Die seal ring and wafer having the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11771122

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PATENT NO	7795704
APP PUB NO	20090001522A1
SERIAL NO	11771122
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 14, 2010	US,7795704,B2 US7795704B2	GRANTED PATENT AS SECOND PUBLICATION
January 01, 2009	US,20090001522,A1 US20090001522A1	FIRST PUBLISHED PATENT APPLICATION

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11771122

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